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The Electronic Packaging Laboratory is an interdisciplinary research center of the University at Buffalo, The State University of New York. The purpose of this laboratory is to develop the computational and experimental tools needed to develop the next generation of nanoelectronics and nanophotonics devices.

Conducting research for the next generation of nanoelectronics/ nanophotonics requires interdisciplinary collaboration between experts in solid mechanics, structural analysis, materials, electronics, circuits, photonics, heat transfer, fluid mechanics, manufacturing and design. The EPL strives to educate competitive and self-motivated students and professionals with state-of- the-art knowledge in interdisciplinary research in a unique interdisciplinary environment.

Our graduates have been hired by Microsoft, IBM, Analog Devices, Honda Electronics, Tyco Electronics, among many other prestigious companies.



                         Flip Chip Solder Joint Under EM+TM                                                           Moire Interferometry


                                Multi-Scale Analysis of Electromigration and Thermomigration


                 bSn Surface Diffusivity                             Molecular Dynamics Simulation                                   Finite Element Analysis              



   Contact Us:

For further information, please contact Dr. Cemal Basaran (cjb@buffalo.edu).

102 Ketter Hall • Buffalo, New York 14260 • Phone: 716-645-4375 • Fax: 716-645-3733