UB Electronic Packaging Laboratory

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The Electronic Packaging Laboratory is a research center located at the University at Buffalo, The State University of New York. The purpose of this lab is to develop computational and experimental tools to design the next generation electronic packaging for nanoelectronic devices.

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SEM Image of a Solder Ball After Electromigration

For further information, please contact Dr. Cemal Basaran (cjb@eng.buffalo.edu).
This page has been visited times since 05/01/2006

102 Ketter Hall • Buffalo, New York 14260 • Phone: 716-645-2114 ext. 2429 • Fax: 716-645-3733