Electronic Packaging Laboratory
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List of Publications :
1. Cheng-yong Yan, "A Damage Mechanics Based General Purpose Interface/Contact Element," February, 1998, PhD Dissertation
2. Rumpa Chandaroy, "Damage Mechanics of Microelectronics Packaging Under Combined Dynamic & Thermal Loading" August 1998, PhD Dissertation
3. Ying Zhao," Mechanics of Ball Grid Array Packages: Testing and Modeling,” December 2000, PhD Dissertation.
4. Hong Tang, “A Thermodynamic Damage Mechanics Theory and Experimental Verification: For Thermomechanical Fatigue Life Prediction of Microelectronics” November 2002, PhD Dissertation.
5. Heng Liu,”Phase Reconstruction of Phase Shifted Moire Interferograms Using Continuous Wavelet Transforms,” July 2003, PhD Dissertation.
6. Yujun Wen, “Thermomechanical Analysis of Multilayered Microelectronic Packaging: Modeling and testing” December 2003, PhD Dissertation.
7. Hua Ye,”Mechanical Behavior of Microelectronics and Power Electronics Solder Joints Under High Current Density: Analytical Modeling and Experimental Investigation”, March 2004, PhD Dissertation.
8. Shihua Nie,” A Micromechanical Study on Damage Mechanics of Acrylic Particulate Composites Under Thermomechanical Loadings” May  2005, PhD Dissertation.
9. Juan Gomez “A Thermodynamic Framework for Damage Mechanics of Electronic Packaging Solder Joints Including Size Effects”, February, 2006, PhD Dissertation. 
10. Minghui Lin,” A Thermodynamic Framework for Damage Mechanics of Electromigration and Thermomigration”, September, 2006, PhD Dissertation. 
11. Rumpa Chandaroy, “Nonlinear Dynamic Analysis of Microelectronic Packaging Interconnects “, 12/1996. MS Thesis.
12. Jianbin Jiang,”Size Effect for Pb/Sn Solder Alloys and Its Measurement by Nano Indentation” May 2002, MS Theses
13. Desai, C.S., Basaran, C., and Wu, Z. "Numerical Algorithms and Mesh Dependence in the Disturbed State Concept," Int. Journal for Numerical Methods in Engineering, Vol. 40, 3059-3083, 1997.
14. Basaran, C., Desai, C.S., and Kundu, T. "Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept Part I: Theory and Formulation " Trans. of ASME, Journal of Electronic Packaging, Vol. 120, No. 1, pp. 41-47, 1998.
15. Basaran, C., Desai, C.S., and Kundu, T. "Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept Constitutive Models: Part II: Verification and Application ", Trans. of ASME, Journal of Electronic Packaging, Vol. 120, No. 1, pp. 48-53, 1998.
16. Desai, C. S., Basaran, C., Dishongh, T. and Prince, J.,"Thermomechanical Analysis in Electronic Packaging with Unified Constitutive Models for Materials and Joints,” IEEE Trans. on Comp. Pack. And Manu. Tech, Part B, Trans. on Advanced Packaging, Vol. 21, No. 1, 87-97, 1998.
17. Basaran, C., and Chandaroy, R.,"Finite Element Simulation of the Temperature Cycling Tests," IEEE, Transactions on Components Packaging and Manufacturing Technology -Part A, Vol. 20, No. 4, pp. 530-536, 1997.#3
18. Basaran, C., and Chandaroy, R.,"Nonlinear Dynamic Analysis of Surface Mount Interconnects, Part I: Theory", Trans. of ASME, Journal of Electronic Packaging, Vol. 121, Number 1, pp. 8-12, March 1999. #7a
19. Basaran, C., and Chandaroy, R.,"Nonlinear Dynamic Analysis of Surface Mount Interconnects, Part II: Applications", Trans. of ASME, Journal of Electronic Packaging, Vol. 121, No 1, pp. 12-17, March 1999. #7b
20. Basaran, C., and Chandaroy, R., "Mechanics of Pb40/Sn60 Near –Eutectic Solder Alloys Subjected to Vibrations," Journal of Applied Mathematical Modeling, Vol. 22, pp. 601-627, 1998.
21. Basaran, C., and Yan. C.Y."A Thermodynamic Framework for Damage Mechanics of Solder Joints,” Trans. of ASME, Journal of Electronic Packaging, Vol. 120, 379-384, 1998. #12
22.  Chandaroy, R. and Basaran, C.,"Damage Mechanics of Surface Mount Technology Solder Joints Under Concurrent Thermal and Dynamic Loadings," Trans. of ASME, Journal of Electronic Packaging, Vol. 121, pp. 61-68, 1999.
23. Basaran, C.,”Using Finite Element Analysis for Simulation of Reliability Tests on Solder Joints in Microelectronics Packaging,” Computers & Structures, Vol. 74, Issue 2, pp. 215-231, November, 1999. #9
24. Basaran, C. and Zhao, Y.,”Closed Form vs. Finite Element Analysis of Laminated Stacks,” Int. J. of Finite Elements in Analysis and Design, 32, pp.163-179, 1999. #5
25. Zhao, Y., Basaran, C., Cartwright, A., and Dishongh, T.,”Thermomechanical Behavior of Micron Scale Solder Joints: An Experimental Observation,” Journal of the Mechanical Behavior of Materials, Vol. 10, No. 3, pp. 135-146, 1999. #13
26. Zhao, Y., Basaran, C. Cartwright, A. and Dishongh, T.,”Thermomechanical Behavior of Micron Scale Solder Joints Under Dynamic Loads,” Mechanics of Materials, Vol. 32, Issue 3, pp. 161-173, 2000. #14
27. Basaran, C., Zhao, Y., Cartwright, A. and Dishongh, T.,”Effects of Thermodynamic Loading,” Advanced Packaging, Vol. 1, pp. 51-58, October 2000.  Review article.#17
28. Basaran, C.,” Disturbed State Concept for Metals and Alloys,” J. of Mechanical Behavior of Materials Vol. 10, No. 5-6, pp. 279-311, 2000.
29. Basaran, C. and Zhao, Y.,”Mesh Sensitivity and FEA for Multilayered Electronic Packaging,”  Trans. of ASME, Journal of Electronic Packaging, Vol. 123, 3, pp. 218-224, September 2001. #22
30. Basaran, C., Cartwright, A. and Zhao, Y.,”Experimental Damage Mechanics of Microelectronics Solder Joints Under Concurrent Vibration and Thermal Loading,” Int. J. of Damage Mechanics, Vol. 10, No. 2 pp. 153-170, April 2001. #15
31. Basaran, C., Tang, H., Dishongh, T. and Searls, D.,”Computer Simulations of Solder Joint Reliability Tests,” Advanced Packaging, Vol. 1, pp. 17-22, May 2001.Review article. #27
32. Basaran, C., Dishongh, T., and Zhao, Y.,” Selecting a Temperature Time History for Predicting Fatigue Life of Microelectronics Solder Joints,” Journal of Thermal Stresses, Vol. 24, No. 11, pp. 1063-1084, November, 2001. #20
33. Basaran, C.  and Chandaroy, R.,”Thermomechanical Analysis of Solder Joints Under Thermal and Vibrational Loading,” Tran. ASME Journal of Electronic Packaging, Vol. 124, No 1, pp. 60-67, March 2002. #24
34. Basaran, C., Ye, H., Johnson, R. and Long, J., ”Moire Interferometry for Inspecting BGA Solder Balls for Manufacturing Defects,” Journal  of Global SMT and Packaging, Vol. 2, No. 2,  pp. 9-14,  May 2002. #33
35. Tang, H. and Basaran, C.”Influence of Microstructure Coarsening on Thermomechanical Fatigue Behavior of Pb/Sn Eutectic Solder Joints,” Int. Journal of Damage Mechanics, Vol. 10, No 3, pp. 235-255, July 2001. #29
36. Basaran, C. and Tang, H.,”Implementation of a Thermodynamic Framework for Damage Mechanics of Solder Interconnects in Microelectronic Packaging,” International Journal of Damage Mechanics, Vol. 11, No. 1, pp. 87-108, January 2002. #17
37. Basaran, C., Ye, H., Bush, P., Johnson, R., and Long, J.,” Inspection of Under Bump Metallization – Solder Ball Interfaces by SEM, EDX and Moire Interferometry,” TAP Technology, Vol. 4, pp. 23-27, 2002, Review article.#31
38. Ye, H., Lin, M., and Basaran, C.,”Failure Modes and FEM Analysis of Power Electronic Packaging,” Finite Elements in Analysis and Design, Vol. 38, Issue 7, pp. 601-612, May 2002. #25
39. Basaran, C. and Jiang, J.,”Measuring Intrinsic Elastic Modulus of Pb/Sn Solder Alloys,” Mechanics of Materials, 34, pp. 349-362, 2002, #26
40. Basaran, C., Cartwright, A., Zhao, Y. and Dishongh, T.”Reliability of Solder Bumps”, Advanced Packaging, Vol. 1, pp. 47-56, July 2002, Review Article. #52
41. Dishong, T., Basaran, C., Cartwright, A., Zhao, Y., and  Liu, H., “Impact of Temperature Cycle Profile on Fatigue Life of Solder Joints,” IEEE Transactions on Advanced Packaging, Vol. 25, No 3, pp. 433 –438, August 2002. #35
42. Tang, H. and Basaran, C.”A Damage Mechanics Based Fatigue Life Prediction Model,” Trans. Of ASME, Journal of Electronic Packaging, Vol. 125, No 1, pp. 120-125, March 2003. #21
43. Wen, Y. and Basaran, C.,”Thermal Stress Analysis of Multilayered Microelectronic Packaging,” Trans. Of ASME, Journal of Electronic Packaging, Vol. 125, No 1, pp. 134-138, March 2003. #23 
44. Ye, H., Basaran, C. and Hopkins, D., Thermomigration in Pb-Sn Solder Joints Under Joule Heating During Electric Current Stressing, Applied Physics Letters, Vol. 82, No 8, February 2003, #38.
45. Wen , Y.and  Basaran, C. “Analysis of Multi-layered Microelectronic Packaging Under Uniformly Distributed Loading”, vol 40/13-14, pp 3331 - 3345, International. J. of Solids and Structures, May 2003, #45
46. Ye, H., Hopkins, D. and Basaran, C.”Measuring Joint Reliability: Applying the Moire Interferometry Technique,” Advanced Packaging, Vol. 1, pp.17-20, May 2003, Review article. #46
47. Ye, H., Basaran, C. and Hopkins, D., Damage Mechanics of Microelectronics Solder Joints Under High Current Densities,” International Journal of Solids and Structures, Vol. 40, No. 15,  pp. 4021-4032, July 2003.  #34
48. Basaran, C. and Wen, Y.,”Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation,” Trans. Of ASME J. of Electronic Packaging , Vol 125, No. 3, pp. 426-430, September 2003, #30 
49. Liu, H., Cartwright, A. N. and Basaran, C.,” Sensitivity Improvement in Phase Shifted Moiré Interferograms Using 1-D Continuous Wavelet Transform Image Processing”, Optical Engineering 42(09), pp. 2646-2652, September 2003, #50
50. Ye, H., Hopkins, D. and Basaran, C.,”Measurement of High Electrical Current Density Effects in Solder Joints,” Advanced Microelectronics, Vol. 30, No. 5, pp. 13-16, September 2003, Review Article.#69
51. Ye, H., Basaran, C. Hopkins, D.,”Numerical Simulation of Stress Evolution During Electromigration in IC Interconnect Lines,” IEEE Trans. On  Comp. Packaging Tech. Vol. 26, No. 3 pp.673-681, September 2003.#43
52. Basaran, C., Lin, M. and Ye. H.  “A Thermodynamic Model for Electrical Current Induced Damage”, Int. Journal of Solids and Structures  Vol. 40, No 26 pp. 7315-7327,  November 2003 #37
53. Ye, H., Basaran, C. and Hopkins, D.,”Mechanical Degradation of Microelectronics  Solder Joints Under Current Stressing,” Int. Journal of Solids and Structures, Vol 40 No 26, pp 7269-7284,  November 2003 #40
54. Ye, H., Basaran, C. and Hopkins, D.,”Measurement of High Electrical Current Density Effects in Solder Joints,”  Microelectronics Reliability, Vol. 43, issue 12, pp. 2021-2029, December 2003.  #42
55. Wen, Y. and Basaran, C.,”An Analytical Model for Thermal Stress Analysis of Multi-layered Microelectronic Packaging,” Mechanics of Materials, 36, pp. 369-385, 2004. #47
56. Liu, H., Basaran, C., Cartwright, A. and Casey, W.,” Application of Moiré Interferometry to Determine Strain Fields and Debonding  of Solder Joints in BGA Packages, IEEE Transactions on Components and Packaging Technologies, Vol. 27, No 1, pp. 217- 223, March 2004. #28
57. Ye, H., Basaran, C. and Hopkins, D.,”Pb Phase coarsening in eutectic Pb/Sn flip chip solder joint under electrical current stressing,,” Int. J. of Solids and Structures, 41, pp. 2743-2755, 2004.  #48
58. Liu, H., Cartwright, A., and Basaran, C. Moiré interferogram Phase Extraction: A Ridge Detection Algorithm Based on Continuous Wavelet Transform” Applied Optics, Vol. 43, No. 4/1, pp.850-857, February 2004, #51.
59. Liu, H., Cartwright, A. and Basaran, C.,”Experimental Verification of Improvement of Phase Shifting Moire Interferometry and Wavelet-Based Image Processing,”  Optical Engineering, 43 (05) pp. 1206-1214, May 2004, #56
60. Basaran, C. Tang, H. and Nie, S.,”Experimental Damage Mechanics of Microelectronics Solder Joints Under Fatigue Loading,” Mechanics of Materials, 36, pp. 1111-1121, August 2004, #36
61. Ye, H. Basaran, C. and Hopkins, D.”Deformation of Microelectronic Solder Joints Under Current Str4essing and Numerical Simulation I,” International Journal of Solids and Structures, vol. 41, pp. 4939-4958, September 2004. #59
62. Ye, H. Basaran, C. and Hopkins, D.”Deformation of Microelectronic Solder Joints Under Current Stressing and Numerical Simulation II,” International Journal of Solids and Structures, vol. 41, pp. 4959-4973, September 2004, #60
63. Basaran, C. and Nie, S.”An Irreversible Thermodynamic Theory for Damage Mechanics of Solids,” International Journal of Damage Mechanics, vol. 13, No 3, pp 205-224, July 2004, #41
64. Ye, H., Basaran, C., and Hopkins, D.,” Mechanical Implications of High Current Densities in Flip Chip Solder Joints,” International Journal of Damage Mechanics, Vol. 13, No. 4, pp 335-346, October 2004, #58
65. Gomez, J. and Basaran, C.”A Thermodynamics Based Damage Mechanics Constitutive Model for Low Cycle Fatigue Analysis of Microelectronics Solder Joints Incorporating Size Effect,” International Journal of Solids and Structures, Vol. 42, issue 13, pp. 3744-3772, (2005) #67. 
66. Nie, S., and Basaran, C.  “A Micromechanical Model for Effective Elastic Properties of Particulate Composites with Imperfect Interfacial Bonds,” International Journal of Solids and Structures Vol. 42, pp 4179-4191, 2005, #62
67. Lin, M., and Basaran, C.”Electromigration Induced Stress Analysis Using Fully Coupled Mechanical-Diffusion Equations With Nonlinear Material Properties,” Computational Materials Science, Vol. 34/1  pp. 82-98, May 2005, #64
68. Basaran, C., Ye, H. Hopkins, D., Frear, D. and Lin, J.K.”Failure Modes of Flip Chip Solder Joints Under High Electrical Current Density,” Trans. Of ASME J. of Electronic Packaging, vol. 127, pp. 157-163, June 2005 #53
69. Basaran, C., Zhao, Y., Tang, H. and Gomez, J..”A Damage Mechanics Based Unified Constitutive Model for Solder Alloys,” Trans of ASME, Journal of Electronic Packaging, Vol. 127, issue 3, pp. 208-214, September 2005 . #18
70. Ye, H., Basaran, C. and Hopkins, D., ”Experimental Damage Mechanics of Micro/Power Electronics of Solder Joints Under Electrical Current Stresses,” Int. J. of Damage Mechanics, vol. 15, pp. 41-68, January 2006,  #65
71. Gomez, J. and Basaran, C. “ Nanoindentation of Pb/Sn Solder Alloys; Experimental and Finite Element Simulation Results”, Int. J. of Solids and Structures, vol. 43, (2006), pp. 1505-1527, 2006, #77
72. Gomez, J. and Basaran, C., ”Damage Mechanics Constitutive Model for Pb/Sn Solder Joints Incorporating Nonlinear Kinematic Hardening and Rate Dependent Effects Using a Return Mapping Integration Algorithm,” Mechanics of Materials, 38 (2006), 585-598. #72
73. Gomez, J, Lin, M. and Basaran, C. “Damage Mechanics Modeling of Concurrent Thermal And Vibration Loading On Electronics Packaging” Multidiscipline Modeling in Materials and Structures, Vol.2,  No.3, pp. 309-326, July 2006. #71.
74. Nie, S., Basaran, C., Hutchins, S. and Ergun, H,” Failure Mechanisms in PMMA/ATH Acrylic Casting Dispersion,”  Journal of Mechanical Behavior of Materials, Vol. 17, No 2, 2006, pp. 79-95, #39
75. Basaran, C. and Nie, S.“A Thermodynamics Based Damage Mechanics Model for Particulate Composites,” International Journal of Solids and Structures, 44, (2007) 1099-1114. #63
76. Basaran, C. and Wen, Y., ”Analysis of Multilayered Microelectronic Packaging Under Thermal Gradient Loading,” IEEE Trans. On Components and Packaging Technologies, vol. 29, no 4, pp. 850-855, December 2006, #75.
77. Basaran, C. and Wen, Y. “Influence of Interfacial Compliances on Thermomechanical Stresses in Multilayered Microelectronic Packaging,” IEEE Trans. On Advanced Packaging, vol. 29, No. 4, pp. 666-673, November 2006,#61
78. Basaran, C. and Lin, M.,” Damage Mechanics of Electromigration in Microelectronics Copper Interconnects,” International Journal of Materials and Structural Integrity, vol. 1, Nos1/2/3, 16-39, 2007, #76
79. Cemal Basaran and Minghui Lin “Electromigration Induced Strain Field Simulations for Nanoelectronics Lead-Free Solder Joints”, Int. J. of Solids and Structures, 44, (2007), 4909-4924. #68.
80. Gomez, J., and Basaran, C., ”Determination of Strain Gradient Plasticity Length Scale for Microelectronics Solder Alloys,” Trans. Of ASME Journal of Electronic Packaging, ASME Journal of Electronic Packaging, Vo. 129, No. 2, pp-120-128, June 2007. #66
81. Basaran, C., Nie, S., Hutchins, S. and Ergun, H. ,”Influence of Interfacial Bond Strength on Fatigue Life and Mechanical Behavior of a Particulate Composite: An Experimental Study, Int. J. of Damage Mechanics  (accepted August,5 2005), #54 
82. Gomez, J. and Basaran, C. “Computational Implementation of Cosserat Based  Plasticity Theories,”, International Journal of Materials and Production Technology, #78
83. Basaran, C. and Lin, M.,” Damage Mechanics of Electromigration Induced Failure,” Mechanics of Materials (accepted, April 9, 2007)  #74
84. Abdulhamid, M., Basaran, C., Hopkins, D.C. and Lai, Y.S., ”Thermomigration vs. Electromigration in Lead-free Solder Joints,” IEEE Trans. On Advanced Packaging, (submitted April 2007) #79
85. Basaran, C., Nie, S. and Hutchins, C., Time Dependent Behavior of a Particle Filled Composite PMMA/ATH at Elevated Temperatures” Journal of Composite Materials, (submitted June, 25, 2007) #55
86. Basaran, C., Abdulhamid, M., and Hopkins, D.C.,”A Study on Thermomigration Induced Damage in Lead-Free Solder Joints,” IEEE Trans. On Comp. And Packaging Technologies (submitted May 7, 2007), #80
87. Sellers, M. Li, S., Schultz, A., Basaran, C. and Kofke, D., ”Volumetric Strain in FCC Metal Lattice Due to an Atomic Vacancy,” Journal of Mechanics and Physics of Solids (submitted June 29, 2007)
88. Bicheng,  C. and Basaran, C. “Automatic Full Strain Field Moiré Interferometry Measurement with Nano-scale Resolution” Experimental Mechanics (submitted July 3, 2007)
89. Li, S. and Basaran, C. “A Damage Mechanics Model for Thermomigration,” Mechanics and Materials (submitted 2007)
90. Chandaroy, R., and Basaran, C., "Damage Mechanics of a SMT Package Under Thermal & Dynamic Loading," 97-WA/EEP-7, ASME publication individual paper.
91. Basaran, C, Yan, Y., and Zhao, Y. ,”Entropy as a Damage Metric for Fatigue Life Predictions,", 98-WA/EEP-13, ASME publication individual paper.
92. Basaran, C., Chandaroy, R., and Zhao, Y.,”Influence of Grain Size and Microstructure on Dynamic Response of Solder Joints,” 98-WA/EEP-12 ASME publication individual paper.
93. Desai, C.S., Chia, J., Kundu, T., Basaran, C. and Prince, J., "Unified Constitutive Modeling of Interfaces and Materials in Semiconductor Devices", in Structural Analysis in Microelectronics and Fiber Optics, editor E. Suhir, Vol.7, 113-126, 1993, Trans. of ASME-EEP.
94. Basaran, C., Desai, C., Kundu, T. and Prince, J., "Computer Simulation of the Temperature Cycling Tests,” in Structural Analysis in Microelectronics and Fiber Optics, editor E. Suhir, Vol.12, 77-82, 1995, Trans. of ASME-EEP.
95. Basaran, C.,"A Comparison of Viscoplastic and Plastic Constitutive Models for Pb/Sn Solder Alloys," in Structural Analysis in Microelectronics and Fiber Optics, editor E. Suhir, Vol.16, pp.149-153, 1996, Trans. of ASME-EEP.
96. Basaran, C., and Chandaroy, R.,"Material Nonlinear Dynamic Analysis of a Pb40/Sn60 Solder Joint," in Structural Analysis in Microelectronics and Fiber Optics, editor E. Suhir, Vol. 21, pp.227-242, 1997, Trans. of ASME-EEP.
97. Basaran, C. and Chandaroy, R.,”Thermomechanical Analysis of Solder Joints Under Concurrent Dynamic and Thermal Loading,” Advances in Electronic Packaging Editors Agonafer, G, Saka, M. and Lee, Y.C. ASME-EEP-Vol. 26-1, pp. 419-439, 1999.
98. Basaran, C. and Zhao, Y.,”Mesh Sensitivity and FEM Modeling for Multilayered Stacks,” Advances in Electronic Packaging Editors Agonafer, G, Saka, M. and Lee, Y.C. ASME-EEP-Vol. 26-1, pp1147-1154, 1999.
99. Zhao, Y., Dishongh, T., Cartwright, A. and Basaran, C. “Creep Behavior of BGA During Thermal Cycling by Moiré Interferometry”, Advances in Electronic Packaging Editors Agonafer, G, Saka, M. and Lee, Y.C. ASME-EEP-Vol. 26-1, pp 685-691, 1999.
100. Basaran, C., Solving Large-Scale Problems In Mechanics: The Development and Application of Computational Solution Methods, editor Papadrakakis, P., John Wiley & Sons, Int. J. for Numerical and Analy. Meth. In Geomechanics, Vol.18, 139-140, 1994.
101. Desai, C.S., Chia, J., Kundu, T., Basaran, C., and Prince, J., "Constitutive Modeling for Thermomechanical Response of Semiconductor Chip-Substrate Systems," Proc. of the Joint ASCE-ASME-SES Meeting on Applied Mechanics in Electronic Packaging, Charlottesville, Virginia, June 1993. 
102. Desai, C.S., Chia, J., Basaran, C., Kundu, T. and Prince, J., "Constitutive Modeling of Mechanical Response of Semiconductor Devices with Emphasis on Interface Behavior," Proc. of the NSF Design and Manufacturing Systems Conference, Charlotte, NC, December 1993.
103. Basaran, C., "A Constitutive Model for Sand," Proc. of the IACMAG 94 - VIII International Conference on Computer Methods and Advances in Geomechanics, May 22-28, 1994, Morgantown, West Virginia. 
104. Desai, C.S., Basaran, C., Chia, J. and Kundu, T., "Disturbed State Constitutive Models for Thermo-Viscoplastic Behavior of Solids and Interfaces - Computational Aspects," Invited Key Note Paper, Proc. of the III World Congress on Computational Mechanics, Chiba, Japan, 1 - 5 August, 1994. 
105. Desai, C.S., Chia, J., Basaran, C., and Kundu, T., "Disturbed State Concept for Cycling Behavior: Computer Implementation," Invited Key Note Paper, Proc. of the Int. Conf. on Computational Methods in Structural and Geotechnical Engineering, Hong Kong, December 12-14, 1994. 
106. Desai, C., Kundu, T., Chia, J., Basaran, C. and Prince, J. ,"Unified Constitutive Modeling, Testing and Computer Design of Semiconductor Devices with Emphasis on Interface Behavior," Proc. of the National Science Foundation Manufacturing and Industrial Innovation Conf., University of California San Diego, CA, January 4-6, 1995.
107. Desai, C.S. and Basaran, C.,"Disturbed State Modeling of Materials and Interfaces and Computer Implementation," Invited Key Note Paper, Proc. of the Int. Conf. on Comp. Eng. Science, Mauna Lani, Hawaii, July 30-August 3, 1995. 
108. Basaran, C., and Yan, C.Y.,"An Interface Constitutive Model for Surface Mount Interconnects," Proc.  1997 Joint ASME/ASCE/SES Summer Meeting, Northwestern University June 29- July 2.
109. Basaran, C. and Chandaroy, R.,"Concurrent Dynamic and Thermal Analysis of Surface Mount Solder Joints,” Proc.  1997 Joint ASME/ASCE/SES Summer Meeting, Northwestern University June 29- July 2, 1997.
110. Henry, D., Basaran, C., and Banerjee, P.K.," A Boundary Element Analysis of Multilayered Structures in Electronics Packaging," Proc.  1997 Joint ASME/ASCE/SES Summer Meeting, Northwestern University June 29- July 2, 1997.
111. Basaran, C. and Yan, C.Y.,"A Damage Criterion Based on Entropy," Proc. of 12th ASCE Engineering Mechanics Conference, SanDiego, CA, May 17-20, 1998.
112. Basaran, C., and Zhao, Y.,”Numerical Analysis of Stacks with Very Thin and Very Thick Layers,”13th US National Congress of Applied MechanicsUniversity of Florida, Gainsville, FL, June 21-June26, 1998.
113. Basaran, C. and Yan, C.Y., "A Damage Criterion Based on Entropy for Pb40/Sn60 Solder Alloys," ASME, Int. Mechanical Engineering Congress and Exposition, Anaheim, CA November 15-20, 1998. 
114. Basaran, C., and Chandaroy, R.,”Thermomechanical Analysis of Solder Joints Under Concurrent and Dynamic Loading,” ASME, Int. Mechanical Engineering Congress and Exposition, Anaheim, CA November, 15-20, 1998. 
115. Basaran, C. and Chandaroy, R.,”Thermomechanical Analysis of Solder Joints Under Concurrent Dynamic and Thermal Loading,” ASME/IEEE InterPACK 99 June 13-19, 1999 Maui, Hawaii.
116. Basaran, C. and Zhao, Y.,”Mesh Sensitivity and FEM Modeling for Multilayered Stacks,” ASME/IEEE InterPACK 99 June 13-19, 1999 Maui, Hawaii.
117. Zhao, Y., Dishongh, T., Cartwright, A. and Basaran, C. “Creep Behavior of BGA During Thermal Cycling by Moiré Interferometry”, ASME/IEEE InterPACK 99 June 13-19, 1999 Maui, Hawaii.
118. Basaran, C., and Yan, C.Y.,”A Damage Mechanics Based Interface Element for Multilayered Packages,” ASME, Int. Mechanical Engineering Congress and Exposition, Nashville, TN November 14-19, 1999.
119. Basaran, C. and Chandaroy, R.,” A Damage Mechanics Based Constitutive Model for Pb/Sn Solder Alloys,” ASME, Int. Mechanical Engineering Congress and Exposition, Nashville, TN November 14-19, 1999.
120. Basaran, C., and Zhao, Y., Mechanical Behavior of BGA During Vibrations by Moiré Interferometry,” ASME, Int. Mechanical Engineering Congress and Exposition, Nashville, TN November 14-19, 1999.
121. Basaran, C. and Zhao, Y.,”Closed Form vs. Finite Element Analysis of Laminated Stacks in Electronic Packaging,” ASME, Int. Mechanical Engineering Congress and Exposition, Nashville, TN November, 14-19, 1999.
122. Zhao, Y., Dishongh, T., Cartwright, A. and Basaran, C.,”Inelastic Behavior of Microelectronics Solder Joints Under Concurrent Vibration and Thermal Cycling,” proc. Itherm 2000, VIIth Thermal and Thermomechanical Phenomena in Electronic Systems, Vol. II, pp. 349-355, Las Vegas, NV May 23-26, 2000.
123. Zhao, Y., Dishongh, T., Cartwright, A. and Basaran, C.,”Thermomechanical Behavior of BGA Solder Joints Under Vibrations; An Experimental Observation,”  Proc. Itherm 2000, VIIth Thermal and Thermomechanical Phenomena in Electronic Systems, Vol. I, pp.174-180, Las Vegas, NV May 23-26, 2000.
124. Basaran, C. and Zhao, Y.,”A Constitutive Model for Pb/Sn Solder alloys,”Proc. SMTA International Assembly Technology Expo., Sept. 24-28, 2000, Rosemont, IL.
125. Wen, Y. and Basaran, C.,”Analysis of Multilayered Electronic Packaging,” InterPACK 2001, July 8-13 Kauai, Hawaii.
126. Tang, H. Basaran, C. Dishongh, T. and Searls, D.,”Thermomechanical Analysis of Solder Joints using Thermodynamics,” InterPACK 2001, July 8-13   Kauai, Hawaii.
127. Basaran, C. and Jiang, J.”Selecting Elastic Modulus for Pb/Sn Solder Joints; Is it Art or Science? ” InterPACK 2001,  July 8-13   Kauai, Hawaii.
128. Ye, H., Lin M. and Basaran, C.,”Failure Modes in Power Electronic Packaging,” InterPACK 2001, July 8-13 Kauai, Hawaii.
129. Zhao, Y. and Basaran, C. A Constitutive Model for Eutectic Pb/Sn Solder, InterPACK 2001, July 8-13 Kauai, Hawaii.
130. Basaran, C., Zhao, Y., Cartwright, A., Dishongh, T.”Evaluating Solder Joint Fatigue Reliability by Moiré Interferometry,” Proc. Of Advanced Packaging Technologies in the Electronics Industry, SMTA, June 12-13, 2001 Boston, MA
131. Basaran, C. “Reliability of BGA Under Vibrations”, Proc. Of the Surface Mount Technology International Conference September 30 – October 4 2001. Chicago, IL
132. Heng, Liu, Basaran, C. Cartwright, A. and Casey, A,”Moiré Interferometry for Microelectronics Packaging Interface Fatigue Reliability” ManTech 2002, San Diego, April 8-11 2002
133. Ye, H. Basaran, C., Hopkins, D.,”Experimental Study on Reliability of Solder Joints Under Electrical Stressing,” ICAPS, Int. Conf. On Adv. Packag. Systems March 10-13, 2002, Reno, NV
134. Basaran, C. Tang, H. and Dishong, T.,” Experimental Characterization of Material Degradation of Solder Joint under Fatigue Loading,” Proc. Of the VIIIth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, May 29 June1 2002, San Diego, CA.
135. Wen. Y. and Basaran, C. “Grain Growth in Eutectic Pb/Sn Ball Grid Array Solder Joints”, Proc. Of the VIIIth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, May 29 June1 2002, San Diego, CA.
136. Ye, H., Basaran, C and Hopkins, D. Reliability of Solder Joints Under Electrical Stressing, Proc. Of the VIIIth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, May 29 June1 2002, San Diego, CA.
137. Nie, S., Basaran, C. and Hutchins, C. Experimental Study of Failure Mechanics in Particle Filled Acrylic Composites,” VIIIth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, May 29 June1 2002, San Diego, CA.
138.  Ye, H., Hopkins, D., Basaran, C. “Measurement and Effects of High Electrical Current Stress in Solder Joints,” International Microelectronics and Packaging Society, Symposium, Denver, Colorado September 4-6, 2002. IMAPS 2002 Best Student Paper Honorable Mention.
139.
 Basaran, C,”A Damage Mechanics Theory Without a Potential Surface,” Society of Engineering Science 39th Annual Meeting, Penn State, October 13-16, 2002 (Abstract only)
140.
 Ye, H., Basaran, C., and Hopkins, D.,”Damage Mechanics of Microelectronics Solder Joints Under High Current Density,” ASME IMECE, New Orleans, LA, November, 17-22, 2002.
141.
 Basaran, C., Nie, S.,” Irreversible Thermodynamics for Damage Mechanics of Elastic-Brittle Materials,” ,” ASME IMECE, New Orleans, LA, November, 17-22, 2002.
142.
 Basaran, C., Tang, H.,”Experimental Damage Mechanics of Microelectronics Solder Joints,” ,” ASME IMECE, New Orleans, LA, November, 17-22, 2002.
143.
 Basaran, C., and Tang, H.”Implementation of a Thermodynamic Framework for Damage Mechanics of Solder Interconnects,”” ASME IMECE, New Orleans, LA, November, 17-22, 2002.
144.
 Basaran, C. and Jiang, J.,”Elastic Modulus of Pb/Sn Solder Joints in Microelectronics,” ,” ASME IMECE, New Orleans, LA, November, 17-22, 2002.
145.
 Ye, H., Basaran. C and Hopkins, D.,”Damage Mechanics of Microelectronics Solder Joints Under High Current Density,” The 54th Electronic Components and Technology Conf. June 1-4, 2004, Las Vegas, NV. 
146.
 Wen, Y. and Basaran, C.,”Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging,” The 54th Electronic Components and Technology Conf. June 1-4, 2004, Las Vegas, NV.
147.
 Basaran, C., Lin, M. and Ye, H.,”Thermodynamic Model for Electrical Current Induced Damage in Microelectronics Solder Joints,” The 54th Electronic Components and Technology Conf. June 1-4, 2004, Las Vegas, NV.
148.
 Basaran, C.  Ye, H.and Hopkins D.,”Deformation of Solder Joints Under Current Stressing: Experimental Measurement and Numerical Simulation” 21st International Congress of Theoretical and Applied Mechanics, August 15-21, 2004, Warsaw, Poland.
149.
  Gomez, J. and Basaran, C.”A Damage Mechanics Based Constitutive Model for Low Cycle Fatigue Analysis,” Proc. Of the IMAPS Congress 2004, Anaheim, CA
150.
 Ye, H.,  Basaran, C. and  Hopkins, D.C. “Measuring and Modeling the Deformation of BGA Lead-free Solder Joints under High Current Density,” Proc. Of the IMAPS Congress 2004, Anaheim, CA
151.
 Lin, M. and Basaran, C.,” Electromigration Induced Strain Field Simulation for Microelectronic Lead Free Solder Joints,” Proc. Of the IMAPS Congress 2004, Anaheim, CA
152.
 Nie, S. and Basaran, C. and Tang, H.,” Experimental Damage Mechanics of Microelectronics Solder Joints Under Fatigue Loading,” The 55th Electronic Components and Technology Conference May 31- June 3, 2005 Lake Buena Vista, Florida 
153.
 Gomez, J. and Basaran, C. “Low Cycle Fatigue Analysis of Microelectronics Solder Joints Incorporating Damage and Size Effects Using a Thermodynamic Based Rate Dependent Constitutive Model,” The 55th Electronic Components and Technology Conference May 31- June 3, 2005 Lake Buena Vista, Florida 
154.
 Basaran, C. Ye, H, and Hopkins, D. “Modeling Deformation in Microelectronics BGA Solder Joints Under High Current Density: Simulation and Testing,” The 55th Electronic Components and Technology Conference May 31- June 3, 2005 Lake Buena Vista, Florida
155.
 C.Basaran, S.Nie, C.S. Hutchins ve H.Ergun, " An Experimental Study on the influence of Filler-Matrix Interfacial Bond Strength and Temperature in a Composite Material", XIV. National Mechanics Congress, 12-16 September 2005, Antakya, Turkey.
156.
 Hopkins, D., Kellerman, D., Wunderlich, R.,Basaran, C and Gomez, J.”High Temperature High Density Packaging of a 60kW Converter for 200C Embedded Operation,”  IEEE Power Electronics Conference (APEX), Dallas, TX March 19-23, 2006.
157.
 Basaran, C. and Lin, M. abstract “Electrical Current Induced Stress Analysis in Nanowires,” 15th US National Congress of Theoretical and Applied Mechanics, Boulder, CO 25-30 June 2006, 
158.
 Abdulhamid, M., Basaran, C., Hopkins, H. Experimental Study of Thermomigration in Lead-Free nanoelectronics Solder Joints, ASME IMECE November 5-10, 2006 Chicago, IL.
159.
 Li, S., Lin., M., Abdulhamid, M. and Basaran, C. Thermomigration Induced Strain Field Simulation for Microelectronics Lead Free Solder Joints, ASME IMECE November 5-10, 2006 Chicago, IL.
160.
 Gomez, J. and Basaran. C., Length Scale in Solder Joints, ASME IMECE November 5-10, 2006 Chicago, IL.
161.
 C. Basaran, Key Note Paper, Damage Mechanics of Solder Joints Under High Current Density, Proc. Of the 10th Int. Conf. The Mechanical Behavior of Materials, May 27-30,2007, Busan , Korea., Key Engineering Materials, vols. 345-346, pp. 1403-1410, 2007.
162.
 C. Basaran, M. Lin and S. Li, “ Computational Simulation of Electromigration Induced Damage in Copper Interconnects” Proc. Of the Summer Simulation Multiconference 2007, Organized by Society for Modeling and Simulation July 14-18, 2007, San Diego, CA
163.
 C. Basaran, J. Gomez, M. Lin, and S. Li , Damage Mechanics Modeling of Concurrent Thermal and Vibration Loading On Electronics Packaging, Proc. Of the Summer Simulation Multiconference 2007, Organized by Society for Modeling and Simulation July 14-18, 2007, San Diego, CA
164.
 M. S. Sellers, A. J. Schultz, D. A. Kofke, C. Basaran, “Molecular Dynamics Modeling of Grain Boundary Diffusion in Sn-Ag-Cu Solder” AIChe Annual Meeting, Salt Lake City, Utah, November 4-9, 2007.
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