Services:

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• Computational Reliability Analysis and Design
• Reliability and structural analysis for packages, interconnects, vias, interfaces, devices and substrates
• Material/Interface modeling
• Custom software development for life cycle analysis
• Damage and fracture mechanics
• Nonlinear Finite Element Analysis
• Thermo-elasto-viscoplastic fatigue analysis
• Mode shape/ Modal frequency analysis



• Experimental Reliability Analysis and Design
• Thermal cycling, and vibration testing under extreme conditions
• Electro-migration and thermo-migration testing under high current density
• Lead-Free Solder Material Selection
• Material and Interface Characterization
• Failure Mode Characterization
• Screening and HAST
• Nano-indentation studies for material property determination post manufacturing
• Solder Joint, IMC microstructure and metallurgy inspection
• Solder joint-UBM interface inspection
• Solder joint and printed circuit board quality and integrity studies
• Photo-damage-mechanics
• Moiré Interferometry
• Twyman-Green and Speckle Interferometry